Deposition Temperature Induced Texture and Strengthening of Ti/Ni Multilayer Thin FilmsSource: Journal of Applied Mechanics:;2023:;volume( 090 ):;issue: 012::page 121005-1DOI: 10.1115/1.4062775Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Strong thermal effect on microstructure and mechanical properties of Ti/Ni multilayer thin films was observed from in situ heating during deposition and subsequent annealing. Films deposited at low-temperature show preferred crystallographic texture for both Ti and Ni layers, with columnar structure extending through the layers. The columnar structure becomes more distinct and complete with the increase of temperature up to 300 °C, and meanwhile, more atomic diffusion and intermixing occur along the Ti/Ni interfaces, promoting the formation of Ti-Ni intermetallic precipitates. High-temperature deposition causes disintegration of the layered structure. Columnar Ti-Ni alloys and further recrystallized alloys were detected with the preferred crystallographic texture. For material strength, an increased hardness trend was observed with increasing deposition temperature even with much larger grain size compared to room temperature case. Furthermore, for multilayer systems deposited under low temperature, post-annealing resulted in higher hardness with minimal microstructure modification, with more strengthening observed in lower deposition temperature case.
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contributor author | Yang, Zhou | |
contributor author | Wang, Junlan | |
date accessioned | 2023-11-29T18:52:01Z | |
date available | 2023-11-29T18:52:01Z | |
date copyright | 8/7/2023 12:00:00 AM | |
date issued | 8/7/2023 12:00:00 AM | |
date issued | 2023-08-07 | |
identifier issn | 0021-8936 | |
identifier other | jam_90_12_121005.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4294426 | |
description abstract | Strong thermal effect on microstructure and mechanical properties of Ti/Ni multilayer thin films was observed from in situ heating during deposition and subsequent annealing. Films deposited at low-temperature show preferred crystallographic texture for both Ti and Ni layers, with columnar structure extending through the layers. The columnar structure becomes more distinct and complete with the increase of temperature up to 300 °C, and meanwhile, more atomic diffusion and intermixing occur along the Ti/Ni interfaces, promoting the formation of Ti-Ni intermetallic precipitates. High-temperature deposition causes disintegration of the layered structure. Columnar Ti-Ni alloys and further recrystallized alloys were detected with the preferred crystallographic texture. For material strength, an increased hardness trend was observed with increasing deposition temperature even with much larger grain size compared to room temperature case. Furthermore, for multilayer systems deposited under low temperature, post-annealing resulted in higher hardness with minimal microstructure modification, with more strengthening observed in lower deposition temperature case. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Deposition Temperature Induced Texture and Strengthening of Ti/Ni Multilayer Thin Films | |
type | Journal Paper | |
journal volume | 90 | |
journal issue | 12 | |
journal title | Journal of Applied Mechanics | |
identifier doi | 10.1115/1.4062775 | |
journal fristpage | 121005-1 | |
journal lastpage | 121005-7 | |
page | 7 | |
tree | Journal of Applied Mechanics:;2023:;volume( 090 ):;issue: 012 | |
contenttype | Fulltext |