YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Applied Mechanics
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Applied Mechanics
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Characterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test

    Source: Journal of Applied Mechanics:;2023:;volume( 090 ):;issue: 011::page 111008-1
    Author:
    Dahal, Drishya
    ,
    Rincon-Tabares, Juan-Sebastian
    ,
    Risk-Mora, David Y.
    ,
    Rincon Troconis, Brendy C.
    ,
    Restrepo, David
    DOI: 10.1115/1.4062907
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Characterizing the adhesion between thin films and rigid substrates is crucial in engineering applications. Still, existing standard methods suffer from issues such as poor reproducibility, difficulties in quantifying adhesion parameters, or overestimation of adhesion strength and fracture energy. Recent studies have shown that the blister test (BT) is a superior method for characterizing adhesion, as it provides a quantifiable measurement of mix-mode fracture energy, and it is highly reproducible. In this paper, we present a novel method to characterize mechanical mix-mode adhesion between thin films and rigid substrates using the BT. Our method combines the full triaxial displacement field obtained through digital image correlation with inverse finite element method simulations using cohesive zone elements. This approach eliminates the need for making any mechanistic or kinematic assumptions of the blister formation and allows the characterization of the full traction-separation law governing the adhesion between the film and the substrate. To demonstrate the efficacy of this methodology, we conducted a case study analyzing the adhesion mechanics of a polymeric pressure-sensitive adhesive on an aluminum substrate. Our results indicate that the proposed technique is a reliable and effective method for characterizing the mix-mode traction-separation law governing the mechanical behavior of the adhesive interface and could have broad applications in the field of materials science and engineering. Also, by providing a comprehensive understanding of the adhesion mechanics between thin films and rigid substrates, our method can aid in the design and optimization of adhesively bonded structures.
    • Download: (782.1Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Characterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4294417
    Collections
    • Journal of Applied Mechanics

    Show full item record

    contributor authorDahal, Drishya
    contributor authorRincon-Tabares, Juan-Sebastian
    contributor authorRisk-Mora, David Y.
    contributor authorRincon Troconis, Brendy C.
    contributor authorRestrepo, David
    date accessioned2023-11-29T18:51:09Z
    date available2023-11-29T18:51:09Z
    date copyright8/3/2023 12:00:00 AM
    date issued8/3/2023 12:00:00 AM
    date issued2023-08-03
    identifier issn0021-8936
    identifier otherjam_90_11_111008.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4294417
    description abstractCharacterizing the adhesion between thin films and rigid substrates is crucial in engineering applications. Still, existing standard methods suffer from issues such as poor reproducibility, difficulties in quantifying adhesion parameters, or overestimation of adhesion strength and fracture energy. Recent studies have shown that the blister test (BT) is a superior method for characterizing adhesion, as it provides a quantifiable measurement of mix-mode fracture energy, and it is highly reproducible. In this paper, we present a novel method to characterize mechanical mix-mode adhesion between thin films and rigid substrates using the BT. Our method combines the full triaxial displacement field obtained through digital image correlation with inverse finite element method simulations using cohesive zone elements. This approach eliminates the need for making any mechanistic or kinematic assumptions of the blister formation and allows the characterization of the full traction-separation law governing the adhesion between the film and the substrate. To demonstrate the efficacy of this methodology, we conducted a case study analyzing the adhesion mechanics of a polymeric pressure-sensitive adhesive on an aluminum substrate. Our results indicate that the proposed technique is a reliable and effective method for characterizing the mix-mode traction-separation law governing the mechanical behavior of the adhesive interface and could have broad applications in the field of materials science and engineering. Also, by providing a comprehensive understanding of the adhesion mechanics between thin films and rigid substrates, our method can aid in the design and optimization of adhesively bonded structures.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleCharacterizing the Adhesion Between Thin Films and Rigid Substrates Using Digital Image Correlation-Informed Inverse Finite Elements and the Blister Test
    typeJournal Paper
    journal volume90
    journal issue11
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4062907
    journal fristpage111008-1
    journal lastpage111008-8
    page8
    treeJournal of Applied Mechanics:;2023:;volume( 090 ):;issue: 011
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian