Special Section on InterPACK2021

Abstract

The International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) is a flagship conference of ASME Electronic and Photonic Packaging Division (EPPD). It has served as an international forum within the ASME society to share and exchange latest progresses in the research, development, and applications of electronic and photonic packaging since 1992. The aim of ASME Journal of Electronic Packaging (JEP) Special Section for InterPACK is to publish outstanding papers from technical tracks of InterPACK2021, which was held virtually amid COVID-19 pandemic worldwide. This Special Section of the ASME JEP publishes nine papers presented at the InterPACK2021 in the areas of electronics and photonics packaging, micro-electronics reliability, and advanced thermal management from the silicon, package, to data center level. All nine papers published in this JEP Special Section for InterPACK2021 went through a standard peer-review process for journal papers published by ASME.