contributor author | Qi, Wenliang | |
contributor author | Liu, Tingting | |
contributor author | Zhang, Zichun | |
contributor author | Wang, Bin | |
contributor author | Liu, Qi | |
contributor author | Xu, Yingjie | |
date accessioned | 2023-08-16T18:05:53Z | |
date available | 2023-08-16T18:05:53Z | |
date copyright | 11/8/2022 12:00:00 AM | |
date issued | 2022 | |
identifier issn | 1948-5085 | |
identifier other | tsea_15_2_021004.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4291404 | |
description abstract | With the application of various high-power electronic devices to improving aircraft comprehensive performance, there has been a significant interest in the use of high heat flux dissipation technology to maintain an effective and safe operation for electronic devices. This article presents a numerical study on the thermal and electrical performance of the avionics server module by using single-phase immersion cooling technology with flow distributor and investigates the influence of heat dissipation capacity on the thermal performance of the avionics server module and DC IR-drop of printed circuit board power distribution network (PDN). The simulation results showed that a higher dielectric fluid flowrate can be provided b flow distributor with the same pumping power, and the maximum temperature of the hot spot was 4–8 °C lower than the module without a flow distributor. The result confirmed the improved flow performance and enhances heat transfer of the hot spot for the module with a flow distributor. However, the module without the flow distributor showed better comprehensive cooling performance with about 10–15% reduction in average Nusselt number with an increase in Re. The discrepancy of PDN DC IR-drop under different Re values was constant at 3% for different design geometries, which means the effect of the flow distributor on power delivery capability can be neglected. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effect of Direct Liquid Cooling Technology With Flow Guide Integration on Avionics Devices Thermal and Electrical Performance | |
type | Journal Paper | |
journal volume | 15 | |
journal issue | 2 | |
journal title | Journal of Thermal Science and Engineering Applications | |
identifier doi | 10.1115/1.4055862 | |
journal fristpage | 21004-1 | |
journal lastpage | 21004-9 | |
page | 9 | |
tree | Journal of Thermal Science and Engineering Applications:;2022:;volume( 015 ):;issue: 002 | |
contenttype | Fulltext | |