Effect of Direct Liquid Cooling Technology With Flow Guide Integration on Avionics Devices Thermal and Electrical Performance

Abstract

With the application of various highpower electronic devices to improving aircraft comprehensive performance, there has been a significant interest in the use of high heat flux dissipation technology to maintain an effective and safe operation for electronic devices. This article presents a numerical study on the thermal and electrical performance of the avionics server module by using singlephase immersion cooling technology with flow distributor and investigates the influence of heat dissipation capacity on the thermal performance of the avionics server module and DC IRdrop of printed circuit board power distribution network (PDN). The simulation results showed that a higher dielectric fluid flowrate can be provided b flow distributor with the same pumping power, and the maximum temperature of the hot spot was 4–8 °C lower than the module without a flow distributor. The result confirmed the improved flow performance and enhances heat transfer of the hot spot for the module with a flow distributor. However, the module without the flow distributor showed better comprehensive cooling performance with about 10–15% reduction in average Nusselt number with an increase in Re. The discrepancy of PDN DC IRdrop under different Re values was constant at 3% for different design geometries, which means the effect of the flow distributor on power delivery capability can be neglected.