| contributor author | Liu, Yang | |
| contributor author | Li, Zhao | |
| contributor author | Zhou, Min | |
| contributor author | Zeng, Xianghua | |
| contributor author | Sun, Fenglian | |
| date accessioned | 2022-02-05T22:13:32Z | |
| date available | 2022-02-05T22:13:32Z | |
| date copyright | 1/19/2021 12:00:00 AM | |
| date issued | 2021 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_143_03_031002.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4277158 | |
| description abstract | Cu foam (Cu-F) and Ag-coated Cu-F were added into nano-Ag paste to obtain Cu-F@nano-Ag composite sintered joint. The microstructure, hardness, and shear behavior of the sintered joints were investigated. Experimental results indicated that the addition of Cu-F and Ag-coated Cu-F suppressed the generation and propagation of cracks at the interface of the sintered joint. As the thickness of the Cu-F increased from 0.1 mm to 0.2 mm, the deformation ratio of the Cu-F sheet raised from 12% to 50%. Thereby, the hardness and bonding strength of the sintered joint was improved due to the microstructural densification. The bonding quality between Cu-F and sintered Ag is enhanced by the Ag-coating treatment. Therefore, the Ag-coated composite joints show higher shear strength than the others. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint | |
| type | Journal Paper | |
| journal volume | 143 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4049128 | |
| journal fristpage | 031002-1 | |
| journal lastpage | 031002-7 | |
| page | 7 | |
| tree | Journal of Electronic Packaging:;2021:;volume( 143 ):;issue: 003 | |
| contenttype | Fulltext | |
