| description abstract | This paper presents a simulation study toward analyzing the effect of radial throw in micromilling on quality metrics and on the deviation in tool-tip trajectory from its prescribed pattern. Both the surface location error (SLE) and the sidewall (peripheral) surface roughness are analyzed. The deviation in tool-tip trajectory is evaluated considering the flute-to-flute variations in the uncut chip thickness and changes in the tooth spacing angle. Radial throw indicates the instantaneous radial location of the tool axis, thereby capturing all salient features of tool-tip trajectory deviations, such as the general elliptical form of the radial motions. This is in contrast to the concept of run-out, which is a scalar quantity (total indicator reading) indicating the total displacement or change in the radial throw measured from a perfect cylindrical surface for one complete rotation of the axis. As such, measurement and analysis of radial throw is essential to understanding micromachining processes. In our previous work, we described an experimental approach for accurate determination of radial throw when using ultra-high-speed micromachining spindles. In this work, we present a simulation-based study to relate radial throw parameters and form to SLE, sidewall surface roughness, flute-to-flute variations of uncut chip thickness, and changes in tooth spacing angle for a two fluted micro-endmill. As expected, our study concludes that the magnitude, orientation, and form of radial throw all significantly affect the studied quality metrics, tooth spacing angle, and the flute-to-flute chip thickness variations. Specifically, the presence of radial throw with an elliptical form induces up to 50% variation in SLE, up to 20% variation in sidewall surface roughness, up to 60% variation in tooth spacing angle deviations, and up to 50% variation in flute-to-flute chip thickness. As such, the presented simulation approach can be used to assess the direct (kinematic) effects of the radial throw parameters on the quality metrics and chip thickness variations. | |
