| contributor author | Yu, Xingjian | |
| contributor author | Hu, Run | |
| contributor author | Wu, Ruikang | |
| contributor author | Xie, Bin | |
| contributor author | Zhang, Xiaoyu | |
| contributor author | Luo, Xiaobing | |
| date accessioned | 2019-09-18T09:04:47Z | |
| date available | 2019-09-18T09:04:47Z | |
| date copyright | 4/10/2019 12:00:00 AM | |
| date issued | 2019 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_141_03_031005.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4258606 | |
| description abstract | In this study, we realized a cylindrical tuber silicone layer for improving the light efficiency of chip-on-board light-emitting diodes (COB-LEDs) by fabricating patterned LED substrate with both silicone-wetting and silicone-repellency surfaces. To realize silicone-repellency surface, low surface energy modified nanosilica particles were prepared and deposited on the LED substrate to form porous hierarchical structure. Light efficiency enhancement for blue light COB-LEDs with pure cylindrical tuber silicone layer and white light COB-LEDs with phosphor–silicone composite layer was studied. The results show that for blue light COB-LEDs with pure cylindrical tuber silicone layer, the light efficiency increases with the contact angle and a highest light efficiency enhancement of 62.6% was achieved at 90 deg when compared to the flat silicone layer. For white light COB-LEDs at correlated color temperature (CCT) of ∼5500 K, the cylindrical tuber silicone layer enhances the light efficiency by 13.6% when compared to the conventional flat phosphor layer. | |
| publisher | American Society of Mechanical Engineers (ASME) | |
| title | Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging | |
| type | Journal Paper | |
| journal volume | 141 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4042982 | |
| journal fristpage | 31005 | |
| journal lastpage | 031005-5 | |
| tree | Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003 | |
| contenttype | Fulltext | |
