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contributor authorKhalili, Sadegh
contributor authorAlissa, Husam
contributor authorNemati, Kourosh
contributor authorSeymour, Mark
contributor authorCurtis, Robert
contributor authorMoss, David
contributor authorSammakia, Bahgat
date accessioned2019-09-18T09:04:47Z
date available2019-09-18T09:04:47Z
date copyright4/10/2019 12:00:00 AM
date issued2019
identifier issn1043-7398
identifier otherep_141_03_031004.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4258605
description abstractThere are various designs for segregating hot and cold air in data centers such as cold aisle containment (CAC), hot aisle containment (HAC), and chimney exhaust rack. These containment systems have different characteristics and impose various conditions on the information technology equipment (ITE). One common issue in HAC systems is a pressure build-up inside the HAC (known as backpressure). Backpressure also can be present in CAC systems in case of airflow imbalances. Hot air recirculation, limited cooling airflow rate in servers, and reversed flow through ITE with weaker fan systems (e.g., network switches) are some known consequences of backpressure. Currently, there is a lack of experimental data on the interdependency between overall performance of ITE and its internal design when backpressure is imposed on ITE. In this paper, three commercial 2-rack unit (RU) servers with different internal designs from various generations and performance levels are tested and analyzed under various environmental conditions. Smoke tests and thermal imaging are implemented to study the airflow patterns inside the tested equipment. In addition, the impact of hot air leakage into the servers through chassis perforations on the fan speed and the power consumption of the servers are studied. Furthermore, the cause of the discrepancy between measured inlet temperatures by the intelligent platform management interface (IPMI) and external sensors is investigated. It is found that arrangement of fans, segregation of space upstream and downstream of fans, leakage paths, the location of baseboard management controller (BMC) sensors, and the presence of backpressure can have a significant impact on ITE power and cooling efficiency.
publisherAmerican Society of Mechanical Engineers (ASME)
titleImpact of Server Thermal Design on the Cooling Efficiency: Chassis Design
typeJournal Paper
journal volume141
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4042983
journal fristpage31004
journal lastpage031004-11
treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003
contenttypeFulltext


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