| contributor author | Cheng, Hao | |
| contributor author | Peng, Yang | |
| contributor author | Mou, Yun | |
| contributor author | Sun, Qinglei | |
| contributor author | Chen, Mingxiang | |
| date accessioned | 2019-09-18T09:01:12Z | |
| date available | 2019-09-18T09:01:12Z | |
| date copyright | 5/24/2019 12:00:00 AM | |
| date issued | 2019 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_141_04_041003 | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4257941 | |
| description abstract | In this work, an easy and low-temperature fabrication method of three-dimensional (3D) ceramic substrate was proposed. A 3DPC ceramic substrate was fabricated by molding alkali-activated aluminosilicate cement (AAAC) to form up a dam (cavity) on direct plated copper (DPC) ceramic substrate at low temperature. The effects of viscosity and curing temperature of cement paste on the properties of the 3DPC were investigated. The prepared 3DPC ceramic substrate achieved precise dimensions and structure, especially the manufacturing accuracy error was less than 2.5%. By optimizing process parameters, the shear strength between dam and DPC substrate reached up to 9.5 MPa. Moreover, thermal cycle and heat resistance tests confirmed that 3DPC exhibits excellent thermal reliability. All experimental results demonstrated that 3DPC ceramic substrate could satisfy with three dimension packaging and integration. | |
| publisher | American Society of Mechanical Engineers (ASME) | |
| title | Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste | |
| type | Journal Paper | |
| journal volume | 141 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4043645 | |
| journal fristpage | 41003 | |
| journal lastpage | 041003-7 | |
| tree | Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 004 | |
| contenttype | Fulltext | |
