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contributor authorKumar, Ritunesh
contributor authorSingh, Gurjeet
contributor authorMikielewicz, Dariusz
date accessioned2019-06-08T09:30:00Z
date available2019-06-08T09:30:00Z
date copyright4/10/2019 12:00:00 AM
date issued2019
identifier issn1043-7398
identifier otherep_141_02_021009.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4257835
description abstractMicrochannel heat sink on one hand enjoys benefits of intensified several folds heat transfer performance but on the other hand has to suffer aggravated form of trifling limitations associated with imperfect hydrodynamics and heat transfer behavior. Flow maldistribution is one of such limitation that exaggerates temperature nonuniformity across parallel microchannels leading to increase in maximum base temperature. Recently, variable width channels approach had been proposed by the current authors to mitigate the flow maldistribution in parallel microchannels heat sinks (MCHS), and in the current numerical study, variable height approach is opted for flow maldistribution mitigation. It is found that variable height microchannels heat sinks (VHMCHS) approach mitigates flow maldistribution rapidly in comparison to variable width microchannels heat sinks (VWMCHS) approach, almost 50% computational time can be saved by VHMCHS approach. Average fluid–solid interface temperature fluctuation across parallel microchannels reduces 3.3 °C by VHMCHS in comparison to VWMCHS approach. The maximum and average temperatures of the base of the heat sink are further reduced by 5.1 °C and 2.7 °C, respectively, for the VHMCHS. It is found that overall heat transfer performance of the heat sink improves further by 3.8% and 5.1% for the VWMCHS and VHMCHS, respectively. The pressure drop penalty of the VHMCHS is found to be 7.2% higher than VWMCHS.
publisherThe American Society of Mechanical Engineers (ASME)
titleNumerical Study on Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink: Channels Variable Width Versus Variable Height Approach
typeJournal Paper
journal volume141
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4043158
journal fristpage21009
journal lastpage021009-11
treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002
contenttypeFulltext


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