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    Constructal Design of Circular Multilayer Microchannel Heat Sinks

    Source: Journal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 001::page 11001
    Author:
    Salimpour, Mohammad Reza
    ,
    Al-Sammarraie, Ahmed T.
    ,
    Forouzandeh, Azadeh
    ,
    Farzaneh, Mahsa
    DOI: 10.1115/1.4041196
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Based on the constructal theory concepts, an investigation is carried out to optimize circular multilayer microchannels embedded inside a rectangular heat sink with different numbers of layers and flow configurations. The lower surface of the heat sink is uniformly heated, while both pressure drop and length of the microchannel are fixed. Also, the volume of the heat sink is kept fixed for all studied cases, while the effect of solid volume fraction is examined. All the dimensions of microchannel heat sinks are optimized in a way that the maximum temperature of the microchannel heat sink is minimized. The results emphasize that using triple-layer microchannel heat sink under optimal conditions reduces the maximum temperature about 10.3 °C compared to the single-layer arrangement. Further, employing counter flow configuration in double-layer microchannel improves its thermal performance, while this effect is less pronounced in the triple-layer architecture. In addition, it is revealed that the optimal design can be achieved when the upper channels of a multilayer microchannel heat sink have bigger diameters than the lower ones. Finally, it is observed while using two layers of microchannels is an effective means for cooling improvement, invoking more layers is far less effective and hence is not recommended.
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      Constructal Design of Circular Multilayer Microchannel Heat Sinks

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4256867
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    contributor authorSalimpour, Mohammad Reza
    contributor authorAl-Sammarraie, Ahmed T.
    contributor authorForouzandeh, Azadeh
    contributor authorFarzaneh, Mahsa
    date accessioned2019-03-17T11:17:05Z
    date available2019-03-17T11:17:05Z
    date copyright9/17/2018 12:00:00 AM
    date issued2019
    identifier issn1948-5085
    identifier othertsea_011_01_011001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4256867
    description abstractBased on the constructal theory concepts, an investigation is carried out to optimize circular multilayer microchannels embedded inside a rectangular heat sink with different numbers of layers and flow configurations. The lower surface of the heat sink is uniformly heated, while both pressure drop and length of the microchannel are fixed. Also, the volume of the heat sink is kept fixed for all studied cases, while the effect of solid volume fraction is examined. All the dimensions of microchannel heat sinks are optimized in a way that the maximum temperature of the microchannel heat sink is minimized. The results emphasize that using triple-layer microchannel heat sink under optimal conditions reduces the maximum temperature about 10.3 °C compared to the single-layer arrangement. Further, employing counter flow configuration in double-layer microchannel improves its thermal performance, while this effect is less pronounced in the triple-layer architecture. In addition, it is revealed that the optimal design can be achieved when the upper channels of a multilayer microchannel heat sink have bigger diameters than the lower ones. Finally, it is observed while using two layers of microchannels is an effective means for cooling improvement, invoking more layers is far less effective and hence is not recommended.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleConstructal Design of Circular Multilayer Microchannel Heat Sinks
    typeJournal Paper
    journal volume11
    journal issue1
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4041196
    journal fristpage11001
    journal lastpage011001-11
    treeJournal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 001
    contenttypeFulltext
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