| contributor author | Wang, Szu-Kai | |
| contributor author | Liu, Yao-Hsien | |
| date accessioned | 2019-03-17T11:01:21Z | |
| date available | 2019-03-17T11:01:21Z | |
| date copyright | 12/5/2018 12:00:00 AM | |
| date issued | 2019 | |
| identifier issn | 1948-5085 | |
| identifier other | tsea_011_02_021012.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4256537 | |
| description abstract | Effects of air/water mist flow on endwall heat transfer in a square channel were experimentally investigated using infrared thermography. The purpose was to study the detailed heat transfer contour variation caused by the generation of the liquid films. The surface was roughened with staggered partial pin-fin arrays to enhance flow mixing and liquid entrainment. Two streamwise spacings (Xp/d = 3 and 6) of the fin array were investigated. The gas Reynolds number ranged from 7900 to 24,000. The calculated droplet deposition velocity was comparable to the literature results and was not substantially affected by the gas Reynolds number or fin spacing. For the pin-fin array, heat transfer was dominated by the water accumulation and liquid film formation, which was dependent on the carrier gas flow rate and fin spacing. Furthermore, thick liquid fragments entrained between the fins substantially enhanced local convective heat transfer coefficients. The average heat transfer enhancement on the finned surfaces using mist flow was four times as high as the air flow. The pressure drop from the mist flow was two times as high as the air flow. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Heat Transfer and Friction Measurement in Pin-Fin Arrays Under Mist Flow Condition | |
| type | Journal Paper | |
| journal volume | 11 | |
| journal issue | 2 | |
| journal title | Journal of Thermal Science and Engineering Applications | |
| identifier doi | 10.1115/1.4041635 | |
| journal fristpage | 21012 | |
| journal lastpage | 021012-10 | |
| tree | Journal of Thermal Science and Engineering Applications:;2019:;volume( 011 ):;issue: 002 | |
| contenttype | Fulltext | |