| contributor author | Zhang, Tingting | |
| contributor author | Sammakia, Bahgat G. | |
| contributor author | Yang, Zhihao | |
| contributor author | Wang, Howard | |
| date accessioned | 2019-02-28T11:14:26Z | |
| date available | 2019-02-28T11:14:26Z | |
| date copyright | 6/11/2018 12:00:00 AM | |
| date issued | 2018 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_140_03_031006.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254186 | |
| description abstract | We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network form while AgNPs and AgNFs fuse to join bigger CuMPs upon hot compression, resulting in superior thermal and mechanical performances. The assembly temperature is as low as 125 °C due to the size effect of silver nanoparticulates. The thermal conductivity, k, of the hybrid nanocomposite TIMs is found to be in the range of 15–140 W/mK, exceeding best-performing commercial thermal greases, while comparable to high-end solder TIMs. The dependence of k on the solid packing density and the volume fraction of voids is discussed through comparing to model predictions. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density | |
| type | Journal Paper | |
| journal volume | 140 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4040204 | |
| journal fristpage | 31006 | |
| journal lastpage | 031006-8 | |
| tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 003 | |
| contenttype | Fulltext | |
