contributor author | Lamaison, Nicolas | |
contributor author | Amalfi, Raffaele L. | |
contributor author | Salamon, Todd | |
contributor author | Marcinichen, Jackson B. | |
contributor author | Thome, John R. | |
date accessioned | 2019-02-28T11:14:16Z | |
date available | 2019-02-28T11:14:16Z | |
date copyright | 3/2/2018 12:00:00 AM | |
date issued | 2018 | |
identifier issn | 1043-7398 | |
identifier other | ep_140_01_010901.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254161 | |
description abstract | Gravity-driven two-phase liquid cooling systems using flow boiling within microscale evaporators are becoming a game-changing solution for electronics cooling. The optimization of the system's filling ratio (FR) can however become a challenging problem for a system operating over a wide range of cooling capacities and temperature ranges. The benefits of a liquid accumulator (LA) to overcome this difficulty are evaluated in the present paper. An experimental thermosyphon cooling system was built to cool multiple electronic components up to a power dissipation of 1800 W. A double-ended cylinder with a volume of 150 cm3 is evaluated as the LA for two different system volumes (associated with two different condensers). Results demonstrated that the LA provided robust thermal performance as a function of FR for the entire range of heat loads tested. In addition, the present LA was more effective for a small volume system, 599 cm3, than for a large volume system, 1169 cm3, in which the relative size of the LA increased from 12.8% to 25% of the total system's volume. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis | |
type | Journal Paper | |
journal volume | 140 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4039091 | |
journal fristpage | 10901 | |
journal lastpage | 010901-11 | |
tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001 | |
contenttype | Fulltext | |