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contributor authorDede, Ercan M.
contributor authorZhou, Feng
contributor authorSchmalenberg, Paul
contributor authorNomura, Tsuyoshi
date accessioned2019-02-28T11:14:11Z
date available2019-02-28T11:14:11Z
date copyright3/2/2018 12:00:00 AM
date issued2018
identifier issn1043-7398
identifier otherep_140_01_010904.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254148
description abstractRapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal metamaterial systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board (PCB) technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electrothermal circuit design are the primary focus, some discussion on the extension of thermal guiding (TG) structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Metamaterials for Heat Flow Control in Electronics
typeJournal Paper
journal volume140
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4039020
journal fristpage10904
journal lastpage010904-10
treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 001
contenttypeFulltext


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