Quantitative Prediction of the Whole Peeling Process of an Elastic Film on a Rigid Substrate

Abstract

The whole peeling behavior of thin films on substrates attract lots of research interests due to the wide application of film-substrate systems, which was well modeled theoretically by introducing Lennard–Jones (L-J) potential to describe the interface in Peng and Chen (2015, Effect of Bending Stiffness on the Peeling Behavior of an Elastic Thin Film on a Rigid Substrate,” Phys. Rev. E, 91(4), p. 042401). However, it is difficult for real applications because the parameters in the L-J potential are difficult to determine experimentally. In this paper, with the help of the peeling test and combining the constitutive relation of a cohesive zone model (CZM) with the L-J potential, we establish a new method to find the parameters in the L-J potential. The whole peeling process can then be analyzed quantitatively. Both the theoretical prediction and the experimental result agree well with each other. Finite element simulations of the whole peeling process are carried out subsequently. Quantitative agreements among the theoretical prediction, numerical calculation, and the experiment measurement further demonstrate the feasibility of the method. Effects of not only the interface strength but also the interface toughness on the whole peeling behavior are analyzed. It is found that the peeling force at a peeling angle of 90 deg during the steady-state stage is affected only by the interface toughness, while the peeling force before the steady-state stage would be influenced significantly by the interface toughness, interface strength, and bending stiffness of the film. All the present results should be helpful for deep understanding and theoretical prediction of the interface behavior of film-substrate systems in real applications.