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    Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect

    Source: Journal of Heat Transfer:;2018:;volume( 140 ):;issue: 001::page 11502
    Author:
    Fu, Benwei
    ,
    Zhao, Nannan
    ,
    Tian, Bohan
    ,
    Corey, Wilson
    ,
    Ma, Hongbin
    DOI: 10.1115/1.4037448
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance.
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      Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4251697
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    contributor authorFu, Benwei
    contributor authorZhao, Nannan
    contributor authorTian, Bohan
    contributor authorCorey, Wilson
    contributor authorMa, Hongbin
    date accessioned2019-02-28T11:00:40Z
    date available2019-02-28T11:00:40Z
    date copyright8/23/2017 12:00:00 AM
    date issued2018
    identifier issn0022-1481
    identifier otherht_140_01_011502.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4251697
    description abstractAn extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEvaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect
    typeJournal Paper
    journal volume140
    journal issue1
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4037448
    journal fristpage11502
    journal lastpage011502-8
    treeJournal of Heat Transfer:;2018:;volume( 140 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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