Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow EffectSource: Journal of Heat Transfer:;2018:;volume( 140 ):;issue: 001::page 11502DOI: 10.1115/1.4037448Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance.
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contributor author | Fu, Benwei | |
contributor author | Zhao, Nannan | |
contributor author | Tian, Bohan | |
contributor author | Corey, Wilson | |
contributor author | Ma, Hongbin | |
date accessioned | 2019-02-28T11:00:40Z | |
date available | 2019-02-28T11:00:40Z | |
date copyright | 8/23/2017 12:00:00 AM | |
date issued | 2018 | |
identifier issn | 0022-1481 | |
identifier other | ht_140_01_011502.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4251697 | |
description abstract | An extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Evaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect | |
type | Journal Paper | |
journal volume | 140 | |
journal issue | 1 | |
journal title | Journal of Heat Transfer | |
identifier doi | 10.1115/1.4037448 | |
journal fristpage | 11502 | |
journal lastpage | 011502-8 | |
tree | Journal of Heat Transfer:;2018:;volume( 140 ):;issue: 001 | |
contenttype | Fulltext |