Show simple item record

contributor authorFu, Benwei
contributor authorZhao, Nannan
contributor authorTian, Bohan
contributor authorCorey, Wilson
contributor authorMa, Hongbin
date accessioned2019-02-28T11:00:40Z
date available2019-02-28T11:00:40Z
date copyright8/23/2017 12:00:00 AM
date issued2018
identifier issn0022-1481
identifier otherht_140_01_011502.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4251697
description abstractAn extra high evaporating heat transfer coefficient can be obtained by thin-film evaporation. In the current investigation, a new detailed mathematical model is developed by considering the effects of bulk flow and interfacial thermal resistance on fluid flow and heat transfer in the thin-film region of an evaporating meniscus. In addition to the interfacial thermal resistance occurring at the liquid–vapor interface, the pressure difference between liquid and vapor is considered to the bulk flow effect. The results show that the bulk flow, which depends on the pressure difference between the interfacial pressure and vapor pressure, significantly affects thin-film profile, heat flux distribution, interfacial temperature, meniscus radius, mass flow rate, and average flow velocity in the evaporating thin-film region. While the interfacial thermal resistance occurring at the liquid–vapor interface affects fluid flow and heat transfer in the evaporating thin-film region, the bulk flow effect is more important than the interfacial thermal resistance.
publisherThe American Society of Mechanical Engineers (ASME)
titleEvaporation Heat Transfer in Thin-Film Region With Bulk Vapor Flow Effect
typeJournal Paper
journal volume140
journal issue1
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4037448
journal fristpage11502
journal lastpage011502-8
treeJournal of Heat Transfer:;2018:;volume( 140 ):;issue: 001
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record