Show simple item record

contributor authorMcCann, Scott
contributor authorOstrowicki, Gregory T.
contributor authorTran, Anh
contributor authorHuang, Timothy
contributor authorBernhard, Tobias
contributor authorTummala, Rao R.
contributor authorSitaraman, Suresh K.
date accessioned2017-11-25T07:21:05Z
date available2017-11-25T07:21:05Z
date copyright2017/25/8
date issued2017
identifier issn1043-7398
identifier otherep_139_04_041003.pdf
identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236874
description abstractA method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy-based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10-μm thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m2.
publisherThe American Society of Mechanical Engineers (ASME)
titleDetermination of Energy Release Rate Through Sequential Crack Extension
typeJournal Paper
journal volume139
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4037334
journal fristpage41003
journal lastpage041003-9
treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record