Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
| contributor author | Hsu, Shou-Jen | |
| contributor author | Lee, Chin C. | |
| date accessioned | 2017-11-25T07:21:00Z | |
| date available | 2017-11-25T07:21:00Z | |
| date copyright | 2016/10/10 | |
| date issued | 2016 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_138_04_041006.pdf | |
| identifier uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236825 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4034842 | |
| journal fristpage | 41006 | |
| journal lastpage | 041006-5 | |
| tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004 | |
| contenttype | Fulltext |
