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    A Low-Cost, Automated Wafer Loading System With Submicron Alignment Accuracy for Nanomanufacturing and Nanometrology Applications

    Source: Journal of Micro and Nano-Manufacturing:;2016:;volume( 004 ):;issue: 004::page 41006
    Author:
    Duenner, Andrew
    ,
    Yao, Tsung-Fu
    ,
    De Hoyos, Bruno
    ,
    Gonzales, Marianna
    ,
    Riojas, Nathan
    ,
    Cullinan, Michael
    DOI: 10.1115/1.4034610
    Publisher: The American Society of Mechanical Engineers (ASME)
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      A Low-Cost, Automated Wafer Loading System With Submicron Alignment Accuracy for Nanomanufacturing and Nanometrology Applications

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    http://yetl.yabesh.ir/yetl1/handle/yetl/4235260
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    contributor authorDuenner, Andrew
    contributor authorYao, Tsung-Fu
    contributor authorDe Hoyos, Bruno
    contributor authorGonzales, Marianna
    contributor authorRiojas, Nathan
    contributor authorCullinan, Michael
    date accessioned2017-11-25T07:18:35Z
    date available2017-11-25T07:18:35Z
    date copyright2016/10/10
    date issued2016
    identifier issn2166-0468
    identifier otherjmnm_004_04_041006.pdf
    identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4235260
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Low-Cost, Automated Wafer Loading System With Submicron Alignment Accuracy for Nanomanufacturing and Nanometrology Applications
    typeJournal Paper
    journal volume4
    journal issue4
    journal titleJournal of Micro and Nano-Manufacturing
    identifier doi10.1115/1.4034610
    journal fristpage41006
    journal lastpage041006-8
    treeJournal of Micro and Nano-Manufacturing:;2016:;volume( 004 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian