YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Applied Mechanics
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Applied Mechanics
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

    Source: Journal of Applied Mechanics:;2017:;volume( 084 ):;issue: 007::page 71005
    Author:
    Zhu, Tingting
    ,
    Li, Guangxu
    ,
    Müftü, Sinan
    ,
    Wan, Kai-tak
    DOI: 10.1115/1.4036776
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the nondeformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and “pull-off” or spontaneous detachment from the plate. Simultaneous measurement of (p, w0, c) allows one to determine the adhesion energy, γ. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading–unloading hysteresis. The results are consistent with a large deformation model in the literature.
    • Download: (669.5Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Revisiting the Constrained Blister Test to Measure Thin Film Adhesion

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/4234252
    Collections
    • Journal of Applied Mechanics

    Show full item record

    contributor authorZhu, Tingting
    contributor authorLi, Guangxu
    contributor authorMüftü, Sinan
    contributor authorWan, Kai-tak
    date accessioned2017-11-25T07:16:51Z
    date available2017-11-25T07:16:51Z
    date copyright2017/31/5
    date issued2017
    identifier issn0021-8936
    identifier otherjam_084_07_071005.pdf
    identifier urihttp://138.201.223.254:8080/yetl1/handle/yetl/4234252
    description abstractA thin film is clamped at the periphery to form a circular freestanding diaphragm before a uniform pressure, p, is applied to inflate it into a blister. The bulging membrane adheres to a rigid constraining plate with height, w0, from the nondeformed membrane. Increasing pressure expands the contact circle of radius, c. Depressurization causes shrinkage of the contact and “pull-off” or spontaneous detachment from the plate. Simultaneous measurement of (p, w0, c) allows one to determine the adhesion energy, γ. A solid mechanics model is constructed based on small strain and linear elasticity, which shows a characteristic loading–unloading hysteresis. The results are consistent with a large deformation model in the literature.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleRevisiting the Constrained Blister Test to Measure Thin Film Adhesion
    typeJournal Paper
    journal volume84
    journal issue7
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4036776
    journal fristpage71005
    journal lastpage071005-5
    treeJournal of Applied Mechanics:;2017:;volume( 084 ):;issue: 007
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian