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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Portable electronic devices are commonly exposed to shock and impact loading due to accidental drops. After external impact, internal collisions (termed “secondary impacts” in this study) between vibrating adjacent ...
Influence of Secondary Impact on Printed Wiring Assemblies—Part I: High Frequency “Breathing Mode†Deformations in the Printed Wiring Board
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Design rules for portable electronic device are continuously striving for thinner printed wiring assemblies (PWAs) and smaller clearances because of everincreasing demand for functionality and miniaturization. As a result, ...