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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional (3D) stacked integrated circuit (IC) chips offer significant performance improvement, but offer important challenges for thermal management including, for the case of microfluidic cooling, constraints on ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel Three-Dimensional-Manifold Coolers (EMMC)—Part 3: Addressing Challenges in Laser Micromachining-Based Manufacturing of Three-Dimensional-Manifolded Microcooler Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures. It is especially important ...