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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, ...
Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: As the ban of the Pb use in electronics products is approaching due to the waste electrical and electronic equipment (WEEE) and restriction of hazardous substances (ROHS) directives, electronics ...