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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The aim of this work is to evaluate the changes in microstructures and electrical properties of a tantalum nitride (Ta–N) thin film integrated on an aluminum anodization multichip module deposited ...
Sub-100 μm SnAg Solder Bumping Technology and the Bump Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Lead-free solder bumping and its related interconnection and reliability are becoming one of the important issues in today’s electronic packaging industry. In this paper, alloy electroplating was ...