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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122, No. 2, pp. 128–131]
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In the above paper, p. 130, in the title of Table 1, cm should be changed to m in the denominator of the unit for thermal contact conductance.
Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal ...
Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water ...
Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sodium silicate based thermal interface pastes give higher thermal contact conductance across conductor surfaces than polymer based pastes and oils, due to their higher fluidity and the consequent ...