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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power ...