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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Methodology for Automated Design of Microelectronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A general design methodology for the optimal design of electronic packages is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues ...
Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder is being extensively used in electronic packages for both electrical and mechanical connection. Solder joints are subjected to severe operating conditions and hence their reliability is ...