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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Factors Affecting the Operational Thermal Resistance of Electronic Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal resistance of electronic components is known to often differ considerably between standard test conditions and those found in service. One way to correct for this is to use ...
Forced Convection Board Level Thermal Design Methodology for Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...
A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Electronic package manufacturers publish thermal characteristics of components, which are measured using standard tests, measuring a thermal resistance value for a single component on a standard ...