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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Optimization of Thermoelectric Coolers for Hotspot Cooling in Three Dimensional Stacked Chips
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Threedimensional (3D) chip stacking architecture is expected to reduce form factor, improve performance, and decrease power consumption in future microelectronics. High power density and nonuniform power distribution in ...