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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The results of this study demonstrate the viability of a low cost maskless process for the fabrication of ultra-fine pitch solder bumps. The fabricated solder bump arrays have a pitch and ...