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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Solder Creep-Fatigue Interactions With Flexible Leaded Parts
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic ...
A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each ...
Solder Joint Creep and Stress Relaxation Dependence on Construction and Environmental-Stress Parameters
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Creep strain is probably the most important time-dependent damage accrual factor affecting solder joint reliability. Under typical multi-hour loading conditions, creep-induced strain is a complex ...