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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermomechanical behavior of a new multilayered substrate with embedded passive components is the focus of this study. Such structures are typically susceptible to localized interfacial stresses ...