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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
An Improved Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An improved time-dependent analytical model is developed for predicting the maximum shearing displacement in an area-array electronic assembly under global thermal mismatch loading. The thermal ...
An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed for predicting the time-dependent shearing displacement in area-array solder interconnects due to global CTE mismatch under thermal cycling. As a first step toward ...