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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part II: Results and Discussion
Publisher: The American Society of Mechanical Engineers (ASME)
Mechanical Modeling of Multilayered Films on an Elastic Substrate—Part I: Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper the basic residual stress problem for multilayered or multiple films on an elastic substrate is considered. The stresses may be caused by a homogeneous temperature variation or ...