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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Part (c) of Fig. 6 was inadvertently deleted from the final paper and is reproduced here. The on-line version of the paper has been revised.
Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical ...