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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Shock loads which are characterized by high intensity, short duration, and vibration at varied frequencies can lead to the failure of embedded electronics typically used to operate/control numerous devices. Failure of ...