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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Warpage of Plastic IC Packages as a Function of Processing Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Variation of processing conditions on warpage prediction of a plastic quad flat package (PQFP) is examined. Thermal mismatch between package constituent materials is the major cause of IC package ...
Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the ...