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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Plastic encapsulated semiconductor packages may crack at the corner regions of die pads or chips if internal delamination occurs at an elevated temperature during the reflow soldering process. ...