Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Forced Convection Board Level Thermal Design Methodology for Electronic Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically ...
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Numerical predictive accuracy is assessed for component-printed circuit board (PCB) heat transfer in forced convection using a widely used computational fluid dynamics (CFD) software. In Part I ...