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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of ...