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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This investigation is aimed at the modeling of both the fabrication process and the reliability of press-fit interconnections on moulded interconnect devices (MID). These are multifunctional ...