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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Handbook of Numerical Calculation in Engineering
Publisher: The American Society of Mechanical Engineers (ASME)
Modeling of Natural Convection in Electronic Enclosures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located ...
The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermal design of plate fin heat sinks can benefit from optimization procedures where all design variables are simultaneously prescribed, ensuring the best thermodynamic and air flow ...