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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Failure Analysis of Miniature Solder Specimen
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effects of specimen geometry size on the behavior of 63Sn-37Pb solder are investigated both experimentally in the laboratory and analytically with finite-element simulations. The simulations ...
Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60 Sn-40 Pb solder. Based ...