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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A numerical model is developed that describes the infrared reflow soldering of surface mounted components onto prewired circuit cards. The model predicts convective conditions within the reflow ...