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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental investigation of natural convection liquid immersion cooling of a three by three array of rectangular protrusions in an enclosure is presented. The heated elements geometrically ...
Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A computational study of natural convection in an enclosure as applied to applications in cooling of electronic components is reported. The investigation is for a configuration consisting of a ...