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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The physics explored in this investigation enables short-time scale dynamic phenomenon to be correlated with package failure modes such as solder ball cracking and interlayer debond. It is found ...
On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The demand for higher clock speed and larger current magnitude in high-performance flip chip packaging configurations of small footprint has raised the concern over rapid thermal transients and ...