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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This study first proposes a simple constitutive model for viscoplasticity, which includes the elastic, plastic, and creep strains independently. The plastic strain is evaluated by the flow rule ...